IPDiA has developed a unique technology called PICS – Passive Integrated Connecting Substrate - that allows a wide range of capacitor values to be integrated on silicon. This unprecedented integration capability - up to 250nF/mm² - is the best innovation to achieve optimized Miniaturization, Reliability and Cost Saving for your design.
The Silicon High Density Capacitors can be used throughout a wide range of applications covering functions such as power supply decoupling, signal coupling, pump charging, DC/DC power conversion, etc. IPDiA's technology provides capacitance integration similar to X7R dielectrics with stability and reliability exceeding those of C0G/NP0 ceramic and tantalum capacitors.
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Temperature
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Miniaturization
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Reliability
Electrical Parameters
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Passive integration on Silicon
Assembly
Packaging
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The 3D silicon capacitors product line is :
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