IPDiA has developed a line of Integrated Passive Devices that operate over a band from DC to 10 GHz, covering DCS and cellular as well as Bluetooth, WiFi and Wimax requirements.
Thanks to PICS, IPDiA's IPD technology, a wide variety of passive devices, such as couplers, baluns, transformers, splitters, filters, diplexers and duplexers are integrated on a silicon substrate. This technology can save up to 80 % of the printed circuit board area currently required for discrete SMD solutions. Additionally, significant cost reductions and performance improvements can be achieved by replacing external SMD components by customized IPD dies.
This technology also offers high reliability, up to 10 times better than alternative technologies, such as ceramic or with standard SMD, and eliminates crack phenomena. This silicon based process is compatible with high temperature cycling during manufacturing operations (exceeding 300°C).
IPDiA is offering turnkey solutions, from designing to manufacturing custom dies that match your application perfectly. Moreover, components' library allows you to use our world's leading foundry services for your own design.
Typical reference designs for advanced RF components are :
For specific requests, custom products or component arrays, please feel free to contact us.