Knowles Sound Solutions releases a rectangular receiver called RA6x15x2 FRANKLIN whose dimensions are 6 x 15 x 2 mm.
It has a rear mesh for dust protection and acoustic damping and has been designed for 3GPP Wideband.
It is very sensitive (loud), with triple magnets and with 4 layers coil.
IPx7 waterproof version available.
Knowles Sound Solutions releases a rectangular micro-size speaker called RA11x15x3.5 COBRA whose dimensions are 11 x 15 x 3.5 mm.
It is a high power speaker with 1W power handling capacity.
It has an exclusive Knowles silicone membrane providing highest robustness.
Jacques Cresson’s International Award honors Seltech.
Award For Enterprise in International Trade using Volunteer for International Experience Programme (VIE)
Orly, France, November 19, 2012 – Seltech has just been awarded the 2012 Jacques Cresson’s International Award For Enterprise in international trade using the Volunteer for International Experience Programme (VIE). The award was presented by Mrs. Edith Cresson (former French Prime Minister) on behalf of the External Trade Advisors Committee.
Established in 1989, Seltech is a highly specialized international distributor of acoustic components with offices in France (Paris), the USA (Raleigh, NC) and China (Nanjing and Shenzhen). The company’s export share has grown significantly in the past years reaching 83% of the total revenue in 2012.
The achievement of the Jacques Cresson’s International Award is a recognition of the effort of Seltech and of all its employees. This was accomplished with the help of Volunteers for International Experience, who have worked hard to make the company what it is today. It also celebrates what can be achieved by a French company in the competitive electronic market.
“We are delighted to be honored with the Jacques Cresson’s International Award. This accolade reflects the hard work done to continuously achieve growth overseas and instills great pride throughout our organization. It also affirms our continued focus on growing our international sales.” said Giulio Di Capua, Managing Director, Seltech.
The NVIDIA CUDA ® on ARM Development Kit from SECO, codename CARMA DevKit, is now available to order. It is designed to support the growing demand for computing initiatives around the world for all developers looking to create energy-efficient high-performance computing (HPC) solutions with ARM architecture.
The CARMA DevKit platform helps developers, researchers and solution designers build simple, economical, efficient, and scalable systems for small, medium and large-scale demands.
Software: Linux Ubuntu Derivative OS CUDA® Tool Kit
The CARMA DevKit contains:
Seltech will exhibit at Electronica - the world's leading trade fair for components, systems and applications - in Munich from 13th to 16th November 2012.
Please come to visit us in Hall A5 Booth 516!
We will co-exhibit with Knowles Electronics.
We are presenting:
Come to discover the latest innovations on those acoustic components.
Electronica will be also the occasion to introduce new technology such as N'Bass (virtual back volume).
The product manager & the application support engineer of each product line will be present to answer to all your questions and requirements.
You'll get a clear sense of our strengths, we have:
This European big event for components, systems, and applications is your opportunity to discover Seltech, its dynamic team and products.
We look forward to seeing you.
SELTECH is pleased to inform its valued customers and partners that SELTECH's European headquarters has moved to a new location to serve them better.
Our new address is :SELTECH 2, Allée des Cerisiers94042 CRETEILFrance
Our telephone and fax numbers remain the same that is :Tel. : 00 33 (0)1 48 92 90 02Fax : 00 33 (0)1 48 92 90 03
We are now situated in Créteil - South East of Paris (instead of Orly - South of Paris) and not far from the two Paris international airports "Roissy Charles de Gaulle airport" and "Orly airport".
Please make a note of it for your future communications.
We will be pleased to welcome you into our new premises.
If you have any queries or questions then please contact us.
High definition TV’s and displays offer obvious visual benefits over conventional standard definition sets, but what about audio in telecom world ? Things have changed also thanks to wideband codecs.
Wideband audio (also called HD voice , HD communication, HD telephony, Wideband voice etc) refers to a telephone conversation using a wideband codec, which uses a greater frequency range of the audio spectrum than conventional voiceband telephone calls, resulting in a clearer sound.
It is generally considered between 150Hz – 7000Hz.
Wideband audio goes by various different names but delivers the same undeniable improvement over traditional and narrowband voice quality.
Wideband acoustic components proposed by SELTECH such as loudspeakers, micro-size speakers, dynamic receivers, MEMS microphones etc. cover this frequency range and beyond in order to benefit the advantage of acoustic bandwith offered by IP phones and Digital phones.
Please click here to download a pdf to view our wideband acoustic product range or contact us for more information.
One general trend in electronics is the integration of components and functions in one single integrated circuit. Laurent Dubos, Market Segment Director for Lighting at IPDiA, shows that not only active components can be part of an IC, but also several passive components can be integrated. He demonstrates that besides space savings, quality issues are also a hot topic that need to be looked at and are a reason to use this technology.
The IPD technology (Integrated Passive Device) on silicon are a highly efficient way to integrate several passive components such as resistors, capacitors, inductors, ESD diodes and PIN diodes in a single die. The main benefits of this technology are miniaturization as well as reliability and global manufacturing cost reduction. The level of technology required to manufacture those Silicon Passive component arrays is the same as the one required for manufacturing CMOS die. It is important to note that the fabrication of silicon passive arrays only require standard semiconductor process techniques and the materials used are well known and appreciated for their high reliability.
This Passive Integrated Connecting Substrate (“PICS”) technology exhibits inherent good performance with very high stability (temperature, voltage, ageing), superior reliability and very low parasitic elements (ESR, ESL). It is an excellent alternative to discrete components (MLCC and tantalum capacitors) as its performance is better in a much smaller volume.
The temperature performance exceeds MLCC and tantalum capacitors, like silicon capacitors, are very stable over the -50°C / +200°C temperature range (<0.002%). The capacitance value is also very stable whatever the DC voltage variation applied on the electrodes is (<0.1%/V). There is no trade-off needed between density and stability: “Integrated Passive” technology offers both - unlike MLCC and tantalum components.
Passive components in an SSL Module can withstand more than 150°C. A standard capacitor can’t support a long life time in this type of environment which means the lifetime of the HB-LED device can be decreased sharply. The main advantage of the capacitor built in a silicon passive array is the amazing reliability that exceeds all current market standards. Silicon capacitors are able to bear harsh environment conditions such as those encountered in down hole equipment with the temperature going up to 250 °C.
The main benefits of replacing SMD’s passive components by a silicon passive components array in Solid State Lighting modules are:
|This first case shows the integration of all the components selected in the green areas (schematic below) in a silicon passive component array (IPD) reported on the SSL PCB.|
Figure 1: WLCSP
One more scenario would be to include the IPD die together with the active dies in the SO14 package:
In this example, the key benefits of such a solution are:
Figure 2: wire-bonded IPD (on PCB) + wire-bonded Active Dies (on IPD)
Some big players in the market place have already demonstrated the capability of designing a one chip solution DC converter, based on integrated passive devices.
For more information, please contact us at 该E-mail地址已受到防止垃圾邮件机器人的保护，您必须启用浏览器的Java Script才能看到。
N’Bass™ Virtual Back Volume Technology Doubles the Effective Air Volume in Miniaturized Loudspeaker Systems
Vienna, Austria, February 21, 2012 – Knowles Sound Solutions has launched a sound enhancing technology to increase the acoustic performance in consumer devices with small form factors. N‘Bass™ stands for “enhanced bass“ and enables the smallest possible acoustic designs in smart phones, tablets and other portable media devices.
The patent pending N‘Bass™ Virtual Back Volume technology is a custom-developed material which increases the back volume seen by the loudspeaker by up to 100 %. It provides either better acoustic performance – specifically more bass – or smaller loudspeaker box designs while keeping the same performance. N‘Bass™ also facilitates the usage of bigger loudspeakers, thus providing superior sound performance within the same gross application volume.
“Consumers are demanding better sound performance for the multiple music, video, gaming, and telephone applications provided by the latest generation of smart portable devices,” said Ernst Müllner, President, Knowles Sound Solutions. "Due to the space gained by using N’Bass™, mobile phone and computing manufacturers have more flexibility to design solutions with superior sound and optimized space efficiency.”
Similar to a sponge, the N’Bass™ material adsorbs the air in the loudspeaker box. In this way, it virtually increases the available back volume for the loudspeaker. In addition, the material is non-conductive and has no negative influence on antenna performance.
The first smartphones to incorporate the technology have recently been launched by tier-1 handset OEMs and are currently in mass production. Knowles is the only supplier who offers this specific technology for miniaturized loudspeaker systems.
Please visit www.knowles.com/NBass for more information.
All trademarks and trade names mentioned in this article are the property of their respective holders.
Knowles Sound Solutions releases a rectangular receiver called RA8x15x1.5 NITH whose dimensions are 8 x 15 x 1.5 mm.
It is Hearing Aid Compatible (HAC) and very thin (only 1.5 mm as thickness) thanks to a new triple magnet feature.
It has been designed for 3GPP wide band extended bass response in low leak applications.
Key features :